AMAOE Tin Plating Tool, Model:A19 Pro Upper-layer RAM

Description

1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.
2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.
3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.
4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.
5. Suitable for high-volume chip refurbishment in repair shops.
6. Compact desktop design, for mobile phone repair shops and repair labs.