XZZ L2023 Heating Area Module For iPhone 16 Series

Description

1. Designed for L2023 intelligent desoldering platform
2. Enlarged heating area, supports motherboard repair
3. Built-in strong magnetic design for easy module replacement
4. Securely fasten the motherboard to ensure proper fit during heating
5. Modular design allows for the replacement of corresponding positioning molds, enhancing practicality for maintenance